HIGHLIGHTS
- MediaTek has introduced the Dimensity 8400 chipset for smartphones.
- It is the world’s first all-big-core SoC designed for the premium segment.
- Here’s a detailed breakdown of the specifications and features of the MediaTek Dimensity 8400.
MediaTek has officially launched the Dimensity 8400 processor during an event in China. As the successor to the Dimensity 8300, this new SoC brings significant upgrades in performance and efficiency. Let’s dive into the details.
MediaTek Dimensity 8400 details
The Dimensity 8400 is built on a flagship-level all-big-core architecture, incorporating an 8-core CPU with Arm Cortex-A725 cores clocked up to 3.25GHz. Compared to its predecessor, the Dimensity 8300, the new SoC delivers a 10% improvement in single-core performance while reducing power consumption by 35%.
The chipset includes an Arm Mali-G720 GPU, which boasts a 24% increase in peak performance and a 42% reduction in power consumption compared to its predecessor. It also supports advanced features such as: Hardware-based ray tracing, Variable-rate shading (VRS) andSeamless intelligent network switching.
According to MediaTek, the Dimensity 8400 scored an impressive 6722 points on Geekbench V6.2’s multi-core test, showcasing a 32% performance gain over competing flagship chips from 2024. Additionally, its AnTuTu benchmark score surpassed 1.8 million, making it the most powerful chipset in the Dimensity 8000 series.
MediaTek Dimensity 8400 specifications
- Processor: Octa CPU with 1x Arm Cortex-A725 at 3.25GHz, 1MB L2, 3x Arm Cortex-A725 at 3.0GHz, 512MB L2, 4x Arm Cortex-A725 at 2.1GHz, 256KB L2. 1.3GHz Arm Mali-G720 MC6 GPU.
- Display: Supports WQHD+ resolution with refresh rates up to 144Hz.
- Cameras: Supports single-camera resolutions up to 320MP.
- Connectivity & Other features: 5G, 4G, Wi-Fi 6E, Bluetooth 5.4, GPS L1CA+L5+L1C, BeiDou B1I+ B1C + B2a, Glonass L1OF, Galileo E1 + E5a, QZSS L1CA + L5, NavIC L5.
- RAM & Storage: LPDDR5X RAM and UFS 4 + MCQ (Multi-Cycle Queue) support.
