HIGHLIGHTS
- MediaTek announced the Dimensity 8300 newest processor for Android handsets.
- The chip can support up to 320-megapixel cameras and 5G network downlink speeds of up to 5.17Gbps.
- Read below to know more about the Dimensity 8300.
The Dimensity 8300, MediaTek’s newest processor for Android handsets, was announced on Tuesday. It is based on TSMC’s cutting-edge second-generation 4nm manufacturing technology and has a 30% lower power consumption and 20% better performance than its predecessor.
Complete generative AI support, including large language models (LLMs) and technologies like stable diffusion, is provided by the company’s new chipset. The chip can support up to 320-megapixel cameras and 5G network downlink speeds of up to 5.17Gbps.
Dimensity 8300 Features
With four Arm Cortex-A715 performance cores and four Cortex-A510 efficiency cores, clocked at 3.35GHz and 2.2GHz, respectively, the recently released Dimensity 8300 mobile CPU is an octa-core device. It is compatible with UFS 4 storage with Multi-Circular Queue (MCQ) support and LPDDR5x members. Based on prior benchmark results, it appears that this processor is capable of matching the Snapdragon 8 Gen 2 SoC, which is Qualcomm’s second most potent chip.
Apart from the CPU enhancements described above, the chip is equipped with a Mali-G615 GPU, which is said to consume 55% less power and provide 60% better performance compared to the previous model. According to the business, the chip also has MediaTek’s HyperEngine gaming technology, which keeps track of the temperature of the device and prevents it from overheating while playing games.
Dimensity 8300 Specifications
The MediaTek Dimensity 8300 boasts an Imagiq 980 ISP for images and videos, which is said to provide 4K60fps HDR and support for longer video recording because of improvements in power usage. It can accommodate cameras on smartphones that have up to 320 megapixels in quality.
APU 780 AI processor from MediaTek, which shares an architecture with the more sophisticated Dimensity 9300 chipset, powers the Dimensity 8300, resulting in a 2x and 3.3x boost in INT/FP16 calculation and AI performance, respectively. According to the chipmaker, it also enables Stable Diffusion and on-device generative AI technology with up to 10 billion parameters.
Regarding connectivity, the recently released Dimensity 8300 boasts a 3GPP Release-16 modem that supports both 4G and 5G LTE. Along with support for satellite-based navigation via GPS, GLONASS, and NavIC, the chipset also has Bluetooth 5.4 and Wi-Fi 6E.
Before the year is out, 5G phones powered by the recently disclosed Dimensity 8300 processor will be released, claims MediaTek. The Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 CPUs from Qualcomm are anticipated to be competitors of the chip. Although particular models with the MediaTek processor have not yet been revealed, in the future weeks and months, smartphone manufacturers should reveal upcoming models with the mobile chipset.
